Historically,
numerous events witness the evolution of current VLSI technology. In early
1930s, Lilienfield & Heil discussed on the theoretical development of forerunners
of today's Field effect transistor (FET). Few years later in 1947, John Bardeen,
Walter Brattain and William Schokley at Bell laboratories built the first working
point contact transistor (Nobel Prize in Physics in 1956). This development
marked the practical beginning of microelectronic industry.
Figure 1.1 First trnsister (point contact) in the
world built by John Bardeen, Walter Brattain and William Schokley at Bell
laboratories on December 16, 1947.
In 1958, Jack Kylby built the
first integrated circuit flip flop at Texas Instruments. The work of Kylby has
marked the beginning of so called VLSI design. In the following years the field
was booming with developments one after another.In 1963, Frank Wanlass at
Fairchild described the first CMOS logic gate (nMOS and pMOS). Till 1970s, the
processes using n-MOS became dominant. Gradually, power consumption became a
major issue & because of the advantage of CMOS, it was widely adapted.
1.1. Issues & Trends in digital design
The term
digital has become a part of our everyday life, because of the way these
digital circuits have spread almost all areas of our lives. The technology used
to build digital hardware has developed dramatically over last four decades.
The logic circuits that were built earlier used bulky components whereas today's
circuits are extremely small & efficient. Many integrated circuits of today
contain more than 1 million transistors. The methods of designing integrated
circuits have changed from conventional iterative methods at breadboard level
to sophisticated software tools. Although previous technologies had limited
scope to explore but they opened the door for the information processing
revolution in this field.
1.1.1.
Moore’s
law
The lowest level of digital design is the
device physics & IC manufacturing process. This level is mainly responsible
the advances in speed & density of the IC. The effects of these advances
are summarised in Moore’s law. It states that, “The number of transistors per square inch in an IC doubles every 18
months”. It is worth noting that, with each doubling of density the speed is
also increasing.
Figure 1.2 Increasing transistor densities
1.1.2.
Size
& complexity of integrated circuits:
Integrated circuits can be classified in
terms of number of potential devices used in the design of the circuit. It is
summarised in Table 1.1
Table 1.1:
classification of Integrated circuits by device count
Nomenclature
|
Approximate
development duration
|
Active
device count
|
Typical
functions/ applied to build-
|
SSI (small-scale integration)
|
early 60s
|
1-100
|
Gates, op-amps
|
MSI (medium-scale integration)
|
late 60s
|
100-1000
|
Registers, filters
|
LSI (large-scale integration)
|
early 70s
|
1000-100,000
|
Microprocessors, A/D
|
VLSI (very large-scale integration)
|
early 80s
|
100000-1000000
|
Memories, computers, signal processors
|
ULSI (ultra large-scale integration)
|
late 80 onwards
|
>= 1000000
|
Increasing the current chip densities
|
1.1.3.
Digital
hardware
The digital circuits are called so, because of the way in which
information is represented as electronic signals corresponding to particular
digits. The advent of integrated circuits made it possible to accommodate
number of transistors & ultimately the entire circuit on a single chip. Now a-days
there are number of chips available in the market ranging from very simple
chips with low functionality to extremely complex one. For example, a digital
electronic system may require a microprocessor for some arithmetic operations,
a memory storage for preserving some outputs, some interfacing chips etc. it
may also be needed to design & built a logic circuit from scratch. Such all
hardware components can be broadly categorised in three groups- full custom /
standard chips, semi custom ICs & programmable logic devices.
Numbers of chips are available that have some commonly used fix logic
circuit which can not be changed so can also be called as full custom chips. Generally standard
chips contain a small circuit with few transistors & can perform a
simple function. The designer needs to select appropriate chips to build a
bigger circuit. But having such number of chips on a PCB increases the size of total
circuit.(Examples: 74XX series chips)
In
some situations it is required to design an application oriented chip for
better performance. In this case, usually the required logic circuit is
designed first, and then with the help of a suitable technology is used to
implement it. Finally the chip is manufactured through a foundry. This approach
is called as semi custom design. As
such chips are intended for a specific application, they are also called as Application specific integrated circuit (ASIC).
As custom chips require a large amount of design efforts, the cost for its
production is too high.
Examples: microprocessors, memory chips.
Programmable logic device is a general
purpose chip for implementing logic designs at hardware level. In contrast to
the standard chips which have fixed functionality, it is possible to realise
the logic circuits directly configured by the end user. The PLDs have a very
general structure of programmable switches that can be configured in many
different ways. Most types of PLDs are reprogrammable & corrections can be
made in the design without any risk.
Examples: PLA, PAL, CPLD, FPGA.
Important terms:
1.
Very-large-scale-integration
(VLSI) is defined as a technology that allows the construction and
interconnection of large numbers (millions) of transistors on a single
integrated circuit.
2.
IC- Integrated
circuit is a collection of one or more gates fabricated on a single silicon
chip.
3.
Wafer- is a
thin slice of semiconductor material on which semiconductor devices are made.
Also called a slice or substrate.
4.
Chip- is a
small piece of semiconductor material upon which miniaturised electronic
circuits can be built.
5.
Die- is an
individual circuit or subsystem that is one of several identical chips that are
produced after dicing up a wafer.
6. HDL-
hardware description language- a language which allows structure & function
of a digital circuit to be specified/ modeled.
7. PLD-
programmable logic devices- the chip with a very general structure of
programmable switches that allow the internal circuitry of the chip to be
configured in many different ways.
References:
1. www.wikipedia.org
2. ULSI
semiconductor technology atlas : by- Chih- Hang Tung, Georgr T T Sheng et all
, Wiley pub
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